Detects over-solder, under-solder, missing solder, and bridging on PCB joints — reducing manual inspection and electrical failures.

/ The Challenge
Solder defects drove field failures; manual microscope inspection was a bottleneck and inconsistent.
/ What We Deployed
AI classification grades each joint for the four failure classes at line pace, feeding rework with exact joint locations.
/ The Results



/ Get Started
Send us your part and inspection challenge. We'll run a free POC and show measured results — no commitment.